PCB Substrate: Automotive-grade high-Tg epoxy resin fiberglass board (Tg≥170℃), ordinary consumer electronics FR-4 is strictly prohibited. It must withstand thermal shock and vibration from -40℃ to 125℃.
Copper Foil and Conductive Layer: 1oz standard copper foil is used for the signal layer; 2oz or thicker copper foil is used for the power drive circuit to carry high current and dissipate heat.
Chips and Integrated Circuits: The core is a silicon-based microcontroller (MCU/SoC), with supporting power drive chips (such as IGBT/MOSFET packages), all of which are AEC-Q automotive-grade certified.
Shell Protection Structure: Mainstream use of flame-retardant engineering plastics (ABS, PC/ABS alloy) to meet lightweight and insulation requirements; high-end or high-power modules use extruded aluminum alloy shells to enhance heat dissipation and impact resistance.
Sealing and Connection: Internal potting typically uses silicone or epoxy resin for moisture and shock protection. External interfaces are equipped with high-temperature resistant nylon connectors and rubber sealing rings (IP67 protection).